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IBM Systems literature

Fine Pitch Interconnect Rework for Lead-Free Flip Chip Packages

Multiple device configurations, especially in 2.5D or3D systems, are intimately tied ...

Electrically Testing Non-underfilled Flip Chip Assemblies- Impacts on Interconnect

The trend towards multi-die flip chip packagingfavors the incorporation of a qualified ...

Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components

Cost-efficient assembly of single-mode fibers tosilicon chips is a significant challenge ...

Optoelectronic Chip Assembly Process of Optical MCM

Assembly process reliability for Optical Multi-ChipModules (MCM) is studied and ...

Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks

The assembly processes used to overcome the technical difficulties associated with ...

Ga Liquid Metal Embrittlement for Fine Pitch Interconnect Rework

Heterogeneous integration is considered to beessential to maximal exploitation of ...

Harvard Business Review and IBM Systems - The Ecosystem Equation: Collaboration in the Connected Economy

The future of business is all about connecting - person-to-person, machine-to-machine, ...

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